The next gen VIA codenamed “John”

Via seems to be really focused on the UMPCs. We know Via for long but until their latest C7 they made it into low cost high performance category, which intel seems to be wondering about.

Wenchi Chen, president and CEO of VIA Technologies previewed the next generation of miniature PC platform (you know, he just means the UMPCs and may be the Sony UX Series) with the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with VIA’s upcoming VX700 mobile chipset.

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As a processor plus core logic in a single, complete package, “John” will play an important role in maintaining the pace of miniaturization, especially in the mobile space, when it is launched later this year, according to Chen. Motherboards based on the VIA “John” platform are expected to be available in the fourth quarter of 2006, said Chen.

Chen also stated that the company’s VIA C7-M mobile processor family can be benefited by growing demand for the convergence of notebooks and handhelds into new device categories such as Ultra-Mobile PCs (UMPCs), like those of partners TabletKiosk and PBJ, and PC phones, such as DualCor’s PC, which combines full PC functionality with a PDA and a phone in a ultra compact handheld form factor [...]

Read on [DigiTimes]




1 Response to “The next gen VIA codenamed “John””


  1. 1 UMPC » Blog Archive » Updates: 9th June 2006 Pingback on Jun 9th, 2006 at 2:45 pm

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