VIA’s CX700 packs a horde of features into a 37.5mm x 37.5mm package.
VIA today announced the new CX700 digital media IGP chipset for its C7 and Eden processor platforms. The CX700 offers a rich embedded platform complete in an ultra-efficient (3.5 watt maximum power envelope), single-chip package.
The CX700 features a 128-bit VIA UniChrome Pro IGP core with hardware MPEG-2 decoding, VIA Vinyl HD Audio, support for up to 4GB of either DDR400 or DDR2-533 memory, along with SATA, SATA-II, PATA, and support for up to six USB ports. VIA’s press release claims:
In the CX700, VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate. This represents a major breakthrough for the embedded industry where ultra compactness is essential, and will have significant benefit for embedded boards such as PC/104 and VIA EPIA mainboards [...]
Industry insiders tell us that with the CX700 IGP, we should expect to see even more UMPC manufacturers make announcements since the chipset is really the first full featured, DX8.1 capable IGP with such low power requirements [Read on]
Source [DailyTech]
looks nice but i will wait for a dx9 capable one