Via ships 100,000 ULV chipsets to Samsung

There was Samsung Q1, and then Q1b and now i read Q1P (Am I reading it wrong?) Well according to sources at Digitimes

The Chinese-language Commercial Times reported that VIA Technologies has kicked off volume shipments of 100,000 ULV (ultra low voltage) solutions, the VIA C7-M processor and VX700 chipset, for the Samsung Q1P Ultra Mobile PC (UMPC). VIA on July 7 announced its VIA VX700 chipset for UMPC devices, together with the C7-M/ULV processors.

VIA reportedly volume ships ULV solutions for Samsung Q1P UMPC [DigiTimes Mobos]




2 Responses to “Via ships 100,000 ULV chipsets to Samsung”


  1. 1 Bjorn Stromberg Sep 12th, 2006 at 11:44 pm

    Just so you know, it is the Q1b and not the Q1P.

  2. 2 Joe Sep 13th, 2006 at 8:00 am

    Yes BJorn, I know but check the digitimes link - it says Q1P

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